View CY62167DV3010_5034353.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

CY62167DV30 MoBL
16-Mbit (1M x 16) Static RAM
Features

Thin small outline package (TSOP I) Configurable as 1M x 16 or as 2M x 8 SRAM Wide voltage range: 2.2 V - 3.6 V Ultra-low active power: Typical active current: 2 mA at f = 1 MHz Ultra-low standby power Easy memory expansion with CE1, CE2 and OE features Automatic power-down when deselected Complementary metal oxide semiconductor (CMOS) for optimum speed / power Available in Pb-free and non Pb-free 48-ball very fine ball grid array (VFBGA) and 48-pin TSOP I package
[1]
also has an automatic power-down feature that significantly reduces power consumption by 99% when addresses are not toggling. The device can also be put into standby mode when deselected (CE1 HIGH or CE2 LOW or both BHE and BLE are HIGH). The input/output pins (I/O0 through I/O15) are placed in a high-impedance state when: deselected (CE1 HIGH or CE2 LOW), outputs are disabled (OE HIGH), both Byte High Enable and Byte Low Enable are disabled (BHE, BLE HIGH), or during a Write operation (CE1 LOW, CE2 HIGH and WE LOW). Writing to the device is accomplished by taking Chip Enables (CE1 LOW and CE2 HIGH) and Write Enable (WE) input LOW. If Byte Low Enable (BLE) is LOW, then data from I/O pins (I/O0 through I/O7), is written into the location specified on the address pins (A0 through A19). If Byte High Enable (BHE) is LOW, then data from I/O pins (I/O8 through I/O15) is written into the location specified on the address pins (A0 through A19). Reading from the device is accomplished by taking Chip Enables (CE1 LOW and CE2 HIGH) and Output Enable (OE) LOW while forcing the Write Enable (WE) HIGH. If Byte Low Enable (BLE) is LOW, then data from the memory location specified by the address pins will appear on I/O0 to I/O7. If Byte High Enable (BHE) is LOW, then data from memory will appear on I/O8 to I/O15. See the truth table at the back of this data sheet for a complete description of Read and Write modes.
Functional Description
The CY62167DV30 is a high-performance CMOS static RAM organized as 1M words by 16 bits. This device features advanced circuit design to provide ultra-low active current. This is ideal for providing More Battery Life (MoBL) in portable applications such as cellular telephones. The device
Logic Block Diagram
DATA IN DRIVERS A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0 ROW DECODER
1M x 16 / 2M x 8 RAM Array
SENSE AMPS
I/O0-I/O7 I/O8-I/O15
COLUMN DECODER
BYTE BHE WE OE BLE CE2 CE1
Power-Down Circuit
A11 A12 A13 A14 A15 A16 A17 A18 A19
BHE BLE
CE2 CE1
Note 1. For best-practice recommendations, please refer to the Cypress application note "System Design Guidelines" on http://www.cypress.com.
Cypress Semiconductor Corporation Document Number : 38-05328 Rev. *I
*
198 Champion Court
*
San Jose, CA 95134-1709 * 408-943-2600 Revised November 8, 2010
CY62167DV30 MoBL
Contents
Product Portfolio .............................................................. 3 Pin Configuration ............................................................. 3 Maximum Ratings ............................................................. 4 Operating Range ............................................................... 4 Electrical Characteristics ................................................. 4 Capacitance ...................................................................... 5 Thermal Resistance .......................................................... 5 AC Test Loads and Waveforms ....................................... 5 Data Retention Characteristics ....................................... 5 Data Retention Waveform................................................. 6 Switching Characteristics................................................. 6 Switching Waveforms ...................................................... 7 Truth Table ...................................................................... 11 Ordering Information ...................................................... 12 Ordering Code Definition ........................................... 12 Acronyms ........................................................................ 15 Document Conventions ................................................. 15 Units of Measure ....................................................... 15 Sales, Solutions, and Legal Information ...................... 17 Worldwide Sales and Design Support ....................... 17 Products .................................................................... 17 PSoC Solutions ......................................................... 17
Document Number : 38-05328 Rev. *I
Page 2 of 17
CY62167DV30 MoBL
Product Portfolio
Power Dissipation Product Min CY62167DV30LL 2.2 VCC Range (V) Typ[2] 3.0 Max 3.6 55 70 Speed (ns) Operating ICC(mA) f = 1MHz Typ[2] 2 Max 4 f = fMax Typ[2] 15 12 Max 30 25 Standby ISB2(A) Typ[2] 2.5 Max 22
Pin Configuration
Figure 1. 48- ball VFBGA Top View[3, 4, 5]
1 BLE I/O8 I/O 9 VSS VCC I/O14 I/O15 A18
2 OE BHE I/O 10 I/O 11
3 A0 A3 A5 A17
4 A1 A4 A6 A7 A16 A15 A13 A10
5 A2 CE1 I/O 1 I/O 3 I/O 4 I/O5 WE A11
6 CE2 I/O 0 I/O 2 Vcc Vss I/O 6 I/O 7 DNU A B C D E F G H
[6]
I/O12 DNU I/O13 A19 A8 A14 A 12 A9
48-Pin TSOP I (Forward) (1M x 16/ 2M x 8) Top View
A15 A14 A13 A12 A11 A10 A9 A8 A19 NC WE CE2 DNU BHE BLE A18 A17 A7 A6 A5 A4 A3 A2 A1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24
48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25
A16 BYTE Vss I/O15/A20 I/O7 I/O14 I/O6 I/O13 I/O5 I/O12 I/O4 Vcc I/O11 I/O3 I/O10 I/O2 I/O9 I/O1 I/O8 I/O0 OE Vss CE1 A0
Notes 2. Typical values are included for reference only and are not guaranteed or tested. Typical values are measured at VCC = VCC(typ.), TA = 25 C. 3. NC pins are not connected on the die. 4. DNU pins have to be left floating. 5. Ball H6 for the FBGA package can be used to upgrade to a 32M density. 6. The BYTE pin in the 48-TSOP I package has to be tied to VCC to use the device as a 1M X 16 SRAM. The 48-TSOPI package can also be used as a 2M X 8 SRAM by tying the BYTE signal to VSS. In the 2M x 8 configuration, Pin 45 is A20, while BHE, BLE and I/O8 to I/O14 pins are not used (DNU).
Document Number : 38-05328 Rev. *I
Page 3 of 17
CY62167DV30 MoBL
Maximum Ratings
(Above which the useful life may be impaired. For user guidelines, not tested.) Storage temperature ................................ -65 C to +150 C Ambient temperature with power applied ........................................... -55 C to +125 C Supply voltage to ground potential ...... -0.2 V to VCC + 0.3 V DC voltage applied to outputs in High-Z state[7, 8] ................................ -0.2 V to VCC + 0.3 V DC input voltage[7, 8] ............................. -0.2 V to VCC + 0.3 V
Output current into outputs (LOW) .............................. 20 mA Static discharge voltage.......................................... > 2001 V (per MIL-STD-883, Method 3015) Latch-up current ..................................................... > 200 mA
Operating Range
Device Range Ambient Temperature -40 C to +85 C VCC[9] 2.20 V to 3.60 V
CY62167DV30LL Industrial
Electrical Characteristics Over the Operating Range
CY62167DV30-55 Parameter VOH Description Test Conditions Min Typ Output HIGH voltage IOH = -0.1 mA IOH = -1.0 mA VOL Output LOW voltage IOL = 0.1 mA IOL = 2.1 mA VIH Input HIGH voltage VCC = 2.2 V to 2.7 V VCC= 2.7 V to 3.6 V VIL Input LOW voltage VCC = 2.2 V to 2.7 V VCC= 2.7 V to 3.6 V IIX IOZ ICC Input leakage current GND < VI < VCC Output leakage current VCC Operating supply current Automatic Power-down current -- CMOS inputs Automatic Power-down current -- CMOS Inputs GND < VO < VCC, Output Disabled VCC = VCC(max) IOUT = 0 mA CMOS levels f = fMax = 1/tRC f = 1 MHz - -1 -1 - - - 15 2 2.5 VCC = 2.20 V VCC = 2.70 V VCC = 2.20 V VCC = 2.70 V 1.8 2.2 -0.3 - - VCC 1.8 +0.3 V 2.2 0.6 0.8 +1 +1 30 4 22 - -1 -1 - - - 12 2 2.5 -0.3 - VCC +0.3V 0.6 0.8 +1 +1 25 4 22 A A A mA V 2.0 2.4 - - 0.4 -
[10]
CY62167DV30-70 Unit Min 2.0 2.4 - 0.4 V Typ[10] - Max - V
Max -
-
V
ISB1
CE1 > VCC 0.2 V or CE2 < 0.2 V, VIN > VCC - 0.2 V, VIN < 0.2 V, f = fMax (Address and data only), f = 0 (OE, WE), VCC = 3.60 V CE1 > VCC - 0.2 V or CE2 < 0.2 V VIN > VCC - 0.2 V or VIN < 0.2V, f = 0, VCC = 3.60 V
ISB2
-
2.5
22
-
2.5
22
A
Notes 7. VIL(min.) = -2.0 V for pulse durations less than 20 ns. 8. VIH(max) = VCC + 0.75 V for pulse durations less than 20 ns. 9. Full Device AC operation requires linear VCC ramp from 0 to VCC(min.) and VCC must be stable at VCC(min) for 500s. 10. Typical values are included for reference only and are not guaranteed or tested. Typical values are measured at VCC = VCC(typ), TA = 25 C
Document Number : 38-05328 Rev. *I
Page 4 of 17
CY62167DV30 MoBL
Capacitance
Parameter[11] CIN COUT Description Input capacitance Output capacitance Test Conditions TA = 25 C, f = 1 MHz, VCC = VCC(typ) Max 8 10 Unit pF pF
Thermal Resistance
Parameter[11] JA JC Description Thermal resistance (Junction to ambient) Thermal resistance (Junction to case) Test Conditions Still Air, soldered on a 3 x 4.5 inch, 2-layer printed circuit board VFBGA 55 16 TSOP I 60 4.3 Unit C / W C / W
AC Test Loads and Waveforms
VCC OUTPUT 50 pF[12] INCLUDING JIG AND SCOPE Equivalent to: THEVENIN EQUIVALENT RTH OUTPUT V R1 VCC R2 GND Rise Time = 1 V/ns 10% ALL INPUT PULSES 90% 90% 10% Fall Time = 1 V/ns
Parameters R1 R2 RTH VTH
2.5 V 16667 15385 8000 1.20
3.0 V 1103 1554 645 1.75
Unit V
Data Retention Characteristics (Over the Operating Range)
Parameter VDR ICCDR Description VCC for Data retention Data retention current VCC= 1.5 V, CE1 > VCC - 0.2 V or CE2 < 0.2 V, VIN > VCC - 0.2V or VIN < 0.2 V Conditions Min 1.5 - Typ[12] - - Max - 10 Unit V A
tCDR[11] tR[13]
Chip deselect to data retention time Operation recovery time CY62167DV30LL-55 CY62167DV30LL-70
0 55 70
- -
- -
ns ns
Notes 11. Tested initially and after any design or process changes that may affect these parameters. 12. Typical values are included for reference only and are not guaranteed or tested. Typical values are measured at VCC = VCC(typ), TA = 25 C 13. Full device operation requires linear VCC ramp from VDR to VCC(min.) > 100 s or stable at VCC(min.) > 100 s.
Document Number : 38-05328 Rev. *I
Page 5 of 17
CY62167DV30 MoBL
Data Retention Waveform[14]
VCC
CE1 or BHE,BLE
VCC, min. tCDR
DATA RETENTION MODE VDR > 1.5 V
VCC, min. tR
or
CE2
Switching Characteristics Over the Operating Range
Parameter[15] Read Cycle tRC tAA tOHA tACE tDOE tLZOE tHZOE tLZCE tHZCE tPU tPD tDBE tLZBE tHZBE Write Cycle[18] tWC tSCE tAW tHA tSA tPWE tBW tSD tHD tHZWE tLZWE Write cycle time CE1 LOW and CE2 HIGH to write end Address set-up to write end Address hold from write end Address set-up to write start WE pulse width BLE/BHE LOW to write end Data set-up to write end Data hold from write end WE LOW to High-Z
[16, 17]
Description
55 ns Min 55 - 10 - - 5 - 10 - 0 - - 10 - 55 40 40 0 0 40 40 25 0 - 10 Max - 55 - 55 25 - 20 - 20 - 55 55 - 20 - - - - - - - - - 20 - Min 70 - 10 - - 5 - 10 - 0 - - 10 - 70 60 60 0 0 45 60 30 0 - 10
70 ns Max - 70 - 70 35 - 25 - 25 - 70 70 - 25 - - - - - - - - - 25 -
Unit
Read cycle time Address to data valid Data hold from address change CE1 LOW and CE2 HIGH to data valid OE LOW to data valid OE LOW to LOW Z
[16]
ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns
OE HIGH to High Z[16, 17] CE1 LOW and CE2 HIGH to Low Z[16] CE1 HIGH and CE2 LOW to High Z[16, 17] CE1 LOW and CE2 HIGH to Power-up CE1 HIGH and CE2 LOW to Power-down BLE/BHE LOW to data valid BLE/BHE LOW to Low Z
[16]
BLE/BHE HIGH to HIGH Z[16, 17]
WE HIGH to Low-Z[16]
Notes 14. BHE.BLE is the AND of both BHE and BLE. Chip can be deselected by either disabling the chip enable signals or by disabling both BHE and BLE. 15. Test conditions for all parameters other than Tri-state parameters assume signal transition time of 1 ns/V, timing reference levels of VCC(typ)/2, input pulse levels of 0 to VCC(typ.), and output loading of the specified IOL/IOH as shown in the "AC Test Loads and Waveforms" section. 16. At any given temperature and voltage condition, tHZCE is less than tLZCE, tHZBE is less than tLZBE, tHZOE is less than tLZOE, and tHZWE is less than tLZWE for any given device. 17. tHZOE, tHZCE, tHZBE, and tHZWE transitions are measured when the outputs enter a high impedance state. 18. The internal Write time of the memory is defined by the overlap of WE, CE1 = VIL, BHE and/or BLE = VIL, and CE2 = VIH. All signals must be ACTIVE to initiate a write and any of these signals can terminate a write by going INACTIVE. The data input set-up and hold timing should be referenced to the edge of the signal that terminates the Write.
Document Number : 38-05328 Rev. *I
Page 6 of 17
CY62167DV30 MoBL
Switching Waveforms
Figure 2. Read Cycle 1 (Address Transition Controlled)[19, 20]
tRC ADDRESS tOHA DATA OUT PREVIOUS DATA VALID tAA DATA VALID
Figure 3. Read Cycle 2 (OE Controlled)[20, 21]
ADDRESS
CE1 tRC tPD CE2 BHE/BLE tLZBE tDBE tHZBE tHZCE tACE
OE
DATA OUT VCC SUPPLY CURRENT
tLZOE HIGH IMPEDANCE tLZCE tPU
tDOE DATA VALID
tHZOE HIGH IMPEDANCE ICC ISB
50%
50%
Notes 19. The device is continuously selected. OE, CE1 = VIL, BHE and/or BLE = VIL, and CE2 = VIH. 20. WE is HIGH for read cycle. 21. Address valid prior to or coincident with CE1, BHE, BLE transition LOW and CE2 transition HIGH.
Document Number : 38-05328 Rev. *I
Page 7 of 17
CY62167DV30 MoBL
Switching Waveforms (continued)
Figure 4. Write Cycle 1 (WE Controlled)[22, 23, 24]
tWC ADDRESS tSCE CE1 CE2 tAW tSA WE tBW tPWE tHA
BHE/BLE
OE tSD DATA I/O
See Note 25
tHD
VALID DATA tHZOE
Notes 22. The internal Write time of the memory is defined by the overlap of WE, CE1 = VIL, BHE and/or BLE = VIL, and CE2 = VIH. All signals must be ACTIVE to initiate a write and any of these signals can terminate a write by going INACTIVE. The data input set-up and hold timing should be referenced to the edge of the signal that terminates the Write. 23. Data I/O is high-impedance if OE = VIH. 24. If CE1 goes HIGH and CE2 goes LOW simultaneously with WE = VIH, the output remains in a high-impedance state. 25. During this period, the I/Os are in output state and input signals should not be applied.
Document Number : 38-05328 Rev. *I
Page 8 of 17
CY62167DV30 MoBL
Switching Waveforms (continued)
Figure 5. Write Cycle 2 (CE1 or CE2 Controlled)[26, 27, 28]
tWC ADDRESS tSCE CE1 CE2 tSA tAW tPWE WE tBW tHA
BHE/BLE
OE tSD DATA I/O
Note 29
tHD
VALID DATA tHZOE
Figure 6. Write Cycle 3 (WE Controlled, OE LOW)[28] tWC ADDRESS tSCE CE1 CE2
BHE/BLE
tBW tAW tHA tPWE
WE
tSA
tSD DATA I/O
Note 29
tHD
VALID DATA t
tHZWE LZWE Notes 26. The internal Write time of the memory is defined by the overlap of WE, CE1 = VIL, BHE and/or BLE = VIL, and CE2 = VIH. All signals must be ACTIVE to initiate a write and any of these signals can terminate a write by going INACTIVE. The data input set-up and hold timing should be referenced to the edge of the signal that terminates the Write. 27. Data I/O is high-impedance if OE = VIH 28. If CE1 goes HIGH and CE2 goes LOW simultaneously with WE = VIH, the output remains in a high-impedance state. 29. During this period, the I/Os are in output state and input signals should not be applied. Document Number : 38-05328 Rev. *I Page 9 of 17
CY62167DV30 MoBL
Switching Waveforms (continued)
Figure 7. Write Cycle 4 (BHE/BLE Controlled, OE LOW)[30] tWC ADDRESS CE1 CE2 tAW tBW BHE/BLE tSA WE tPWE tSD DATA I/O
Note 31
tSCE tHA
tHD
VALID DATA
Notes 30. If CE1 goes HIGH and CE2 goes LOW simultaneously with WE = VIH, the output remains in a high-impedance state 31. During this period, the I/Os are in output state and input signals should not be applied.
Document Number : 38-05328 Rev. *I
Page 10 of 17
CY62167DV30 MoBL
Truth Table
CE1 H X X L L L L L L L L L CE2 X L X H H H H H H H H H WE X X X H H H L L L H H H OE X X X L L L X X X H H H BHE X X H L H L L H L L H L BLE X X H L L H L L H H L L Inputs/Outputs High Z High Z High Z Data out (I/O0-I/O15) High Z (I/O8-I/O15); Data out (I/O0-I/O7) Data out (I/O8-I/O15); High Z (I/O0-I/O7) Data in (I/O0-I/O15) High Z (I/O8-I/O15); Data in (I/O0-I/O7) Data in (I/O8-I/O15); High Z (I/O0-I/O7) High Z High Z High Z Mode Deselect/Power-down Deselect/Power-down Deselect/Power-down Read Read Read Write Write Write Output disabled Output disabled Output disabled Power Standby (ISB) Standby (ISB) Standby (ISB) Active (ICC) Active (ICC) Active (ICC) Active (ICC) Active (ICC) Active (ICC) Active (ICC) Active (ICC) Active (ICC)
Document Number : 38-05328 Rev. *I
Page 11 of 17
CY62167DV30 MoBL
Ordering Information
Speed (ns) 55 Ordering Code CY62167DV30LL-55BVI CY62167DV30LL-55BVXI CY62167DV30LL-55ZXI CY62167DV30LL-70BVI Package Package Type Diagram 51-85178 48-ball Fine Pitch BGA (8 x 9.5 x 1 mm) 48-ball Fine Pitch BGA (8 x 9.5 x 1 mm) (Pb-free) 51-85183 48-pin TSOP I (12 x 18.4 x 1 mm) (Pb-free) 51-85178 48-ball Fine Pitch BGA (8 x 9.5 x 1 mm) Operating Range Industrial
70
Please contact your local Cypress sales representative for availability of these parts
Ordering Code Definition
CY
621
6
7D
V30 LL
XX
XXX X
Tem perature Grades I = Industrial Package Type = ZX : TSOP I (Pb-free) BVX : VFBGA (Pb-free) BV : VFBGA Speed Grade Low Power Voltage = 3.0 Bus W idth = X16 D = 130nm Technology Density = 16 M bit M oBL SRAM Fam ily Com pany ID: CY = Cypress
Document Number : 38-05328 Rev. *I
Page 12 of 17
CY62167DV30 MoBL
Package Diagrams
48-ball VFBGA (8 x 9.5 x 1 mm) (51-85178)
51-85178 *A
Document Number : 38-05328 Rev. *I
Page 13 of 17
CY62167DV30 MoBL
48-pin TSOP I (12 x 18.4 x 1 mm) (51-85183)
51-85183 *B
Document Number : 38-05328 Rev. *I
Page 14 of 17
CY62167DV30 MoBL
Acronyms
Acronym CMOS I/O SRAM VFBGA TSOP input/output static random access memory very fine ball grid array thin small outline package Description complementary metal oxide semiconductor
Document Conventions
Units of Measure
Symbol C A mA MHz ns pF V W Unit of Measure degrees Celsius microamperes milliampere megahertz nanoseconds picofarads volts ohms watts
Document Number : 38-05328 Rev. *I
Page 15 of 17
CY62167DV30 MoBL
Document History Page
Document Title: CY62167DV30 MoBL, 16-Mbit (1M x 16) Static RAM Document Number: 38-05328 REV. ** *A *B *C *D *E *F ECN NO. Issue Date 118408 123692 126555 127841 205701 238050 304054 See ECN See ECN 09/30/02 02/11/03 04/25/03 09/10/03 Orig. of Change GUG DPM DPM XRJ AJU New Data Sheet Changed Advanced to Preliminary Added package diagram Minor change: Changed Sunset Owner from DPM to HRT Added 48 TSOP I package Changed BYTE pin usage description for 48 TSOPI package Description of Change
KKV/AJU Replaced 48-ball VFBGA package diagram; Modified Package Name in Ordering Information table from BV48A to BV48B PCI Added 45-ns Speed Bin in AC, DC and Ordering Information tables Added Footnote #12 on page #4 Added Pb-free packages on page # 10 Modified datasheet to explain x8 configurability Removed L power bin from the product offering Updated Ordering Information Table Removed 45-ns. Removed inactive parts from Ordering Information. Updated Packaging Information Updated links in Sales, Solutions, and Legal Information. Updated datasheet as per new template Added Ordering Code Definition, Acronyms and Units of Measure. Updated all tablenotes to footnote. Package diagram updated 51-85178 from ** to *A
*G
492895
See ECN
VKN
*H
2896036
03/19/2010
AJU
*I
3067267
11/08/2010
RAME
Document Number : 38-05328 Rev. *I
Page 16 of 17
CY62167DV30 MoBL
Sales, Solutions, and Legal Information
Worldwide Sales and Design Support
Cypress maintains a worldwide network of offices, solution centers, manufacturer's representatives, and distributors. To find the office closest to you, visit us at Cypress Locations.
Products
Automotive Clocks & Buffers Interface Lighting & Power Control Memory Optical & Image Sensing PSoC Touch Sensing USB Controllers Wireless/RF cypress.com/go/automotive cypress.com/go/clocks cypress.com/go/interface cypress.com/go/powerpsoc cypress.com/go/plc cypress.com/go/memory cypress.com/go/image cypress.com/go/psoc cypress.com/go/touch cypress.com/go/USB cypress.com/go/wireless
PSoC Solutions
psoc.cypress.com/solutions PSoC 1 | PSoC 3 | PSoC 5
(c) Cypress Semiconductor Corporation, 2010. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges. Any Source Code (software and/or firmware) is owned by Cypress Semiconductor Corporation (Cypress) and is protected by and subject to worldwide patent protection (United States and foreign), United States copyright laws and international treaty provisions. Cypress hereby grants to licensee a personal, non-exclusive, non-transferable license to copy, use, modify, create derivative works of, and compile the Cypress Source Code and derivative works for the sole purpose of creating custom software and or firmware in support of licensee product to be used only in conjunction with a Cypress integrated circuit as specified in the applicable agreement. Any reproduction, modification, translation, compilation, or representation of this Source Code except as specified above is prohibited without the express written permission of Cypress. Disclaimer: CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS MATERIAL, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. Cypress reserves the right to make changes without further notice to the materials described herein. Cypress does not assume any liability arising out of the application or use of any product or circuit described herein. Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress' product in a life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges. Use may be limited by and subject to the applicable Cypress software license agreement.
Document Number : 38-05328 Rev. *I
Revised November 8, 2010
Page 17 of 17
MoBL is a registered trademark and More Battery Life is a trademark of Cypress Semiconductor Corporation. All product and company names mentioned in this document may be the trademarks of their respective holders.

▲Up To Search▲

Price & Availability of CY62167DV3010

	To Download CY62167DV3010 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .